TPC-PCT&PRT D Series | Expandable Rich IO Panel PC with Intel 12th Gen. Core i3/i5/i7

TAICENN unveils its latest modular Expandable Rich IO Panel PC with Intel 12th Gen. Core i3/i5/i7 TPC-PCT/PRT D series. Built around industrial display paired with TAICENN’s in-house modular mainboard architecture, this platform unlocks elevated compute capability and versatile functional expansion for demanding factory HMI deployments. Equipped with projected capacitive multi-touch, the TPC-PCT/PRT D series leverages Intel’s cutting-edge 12th Gen Alder Lake-U SoC family, offering three configurable CPU choices: Core i3-1215U, Core i5-1235U and Core i7-1255U, delivering substantial multi-thread performance gains over previous-gen industrial panel PCs.

Engineered for rugged factory environments, the TPC-PCT/PRT D series integrates an extensive portfolio of native I/O ports to simplify field integration. The interface array comprises 2× RJ45 LAN (including one 2.5GbE high-speed port), 2× USB3.1, 2× USB3.0, 1× USB‑C supporting USB3.1 and DP1.4 video output, plus 6× COM ports — 2 of which are BIOS-switchable between RS232, RS485 and RS422 protocols. Additional connectors include a software remote switch, HDMI, DP and audio jacks, while GPIO and CAN bus ports are available as factory options. This comprehensive port set streamlines data exchange and enables seamless connection to PLCs, sensors and peripheral equipment across diverse automation workflows.

The unit accepts wide-range DC input spanning 9V to 36V via terminal block, with built-in protection circuitry guarding against over-current, over-voltage and reverse polarity wiring faults, greatly reducing downtime risks caused by unstable factory power supplies. As part of the TPC-PCT/PRT D-series Expandable Rich IO Panel PC with Intel 12th Gen. Core i3/i5/i7 supports TPM2.0 (PTT2.0) hardware security and runs Windows 11 natively. It features three dedicated high-speed expansion slots: one M.2 3042/3052 B-key slot, one M.2 2230 E-key slot, one SIM card holder and one Mini‑PCIe slot. This multi-slot layout empowers flexible wireless upgrades, supporting Wi‑Fi 6, Bluetooth, 3G/4G and 5G cellular connectivity for edge IoT deployments. Such rich expansion headroom opens broad possibilities to add custom industrial modules and adapt to evolving project requirements.